Nitto Denko Corporation
UV-curable dicing and process tapes.
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About the company
Nitto Denko Corporation is a Japanese diversified materials manufacturer headquartered in Osaka whose semiconductor-process portfolio includes UV-curable adhesive tapes for wafer dicing. Its UV dicing tapes (ELP series, e.g. ELP WS-02T) hold the wafer firmly during dicing and, after UV irradiation, lose tack so the the releases cleanly with residue-free removal. In March 2025 Nitto introduced a new UV-curable dicing tape for next-generation semiconductor devices.
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